Date
Wed.12 June - Fri.14 June, 2024
Venue
Tokyo Big Sight / East Exhibition Halls
Booth
6H-1
© Nippon Electric Glass Co.,Ltd.

Nippon Electric Glass Co., Ltd. is one of the world's leading special glass manufactures that has been in business for over 70 years, and manufactures and supplies glass in various fields such as information and communications,automobiles, energy, medical care, semiconductors, displays, social infrastructure, home appliances and housing.
We can provide consistent support from design and development of glass materials to forming and processing, so we also can make various proposals that suit individual needs.
At JPCA Show 2024, we will exhibit glass products used for semiconductor and various fields.
We are looking forward to seeing you at JPCA Show 2024.

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EXHIBITION PRODUCTS

Packaging

  • Powder Glass

    Powder glass is widely used for hermetic sealing of devices, coating and insulating layer. We have developed and produced different types of powder glass according to various requests.

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  • Glass Frit for Laser-Sealing

    Glass frit for laser-sealing can achieve hermetic sealing between glass substrates or glass and cavity*. Laser-sealing is available for package sealing with less thermal damage on internal devices. Our glass frit is suitable for the technology utilized for hermetic sealing application which requires high reliability.
    *Alumina, LTCC, Silicon

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Substrates

  • LTCC Substrate

    LTCC substrates which possess excellent electrical characteristics, enable lower profile of electronic devices, multi-layering of circuits and dense-mounting. They are used as electronic device packages and communication module substrates, probe card boards in the fields of communication, semiconductor and automobile.

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  • Glass-ceramics Core Substrate GC Core™
    【Developed product】

    Nippon Electric Glass Co., Ltd. has developed a core substrate for semiconductor package with composite material of glass powder and ceramics powder. Micro through-holes can be formed using CO₂ laser. Different properties can be achieved by adjusting the composition and blending ratio of glass and ceramics.

    Download Press Release Download

Photonics

  • Submount with AuSn Solder

    Easy to handle, no need to prepare AuSn solder separately. Cu/Mo multi-layers substrate has a thermal conductivity higher than CuW and CuMo. Graphite+Cu substrate has an ultra-high thermal conductivity property.

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  • Micro Prism

    Micro Prism is used for a variety of applications such as optical communication, medical care, sensing and others. Shapes, sizes and coatings are customizable upon your request.

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  • Phosphor in Glass for UV Wavelength Conversion Lumiphous™

    Lumiphous™ is phosphor in glass developed for wavelength conversion that can contain various phosphors.
    In addition, it has excellent weatherability and light resistance.

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  • Infrared Transmitting Glass/
    Calcogenide Glass

    Our original chalcogenide glass with "high index and high transmission" is suitable for use in the LWIR band. It’s possible to provide our consistent support from optical design, processing, coating, evaluation etc..


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Others

  • Nano-texturing Technology

    Innovative surface processing technology can induce the nanometer-sized texture on the glass surfaces. This technology can be expected to be used in various applications such as friction control.

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  • Glass-ribbon

    Glass-ribbon is so thin that it can be bent or rolled up like resin film. The glass surface is unpolished , but it is extremely flat and smooth.

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CONTACT

Pre-registration for visit

From the offical JPCA Show 2024 website,
please pre-register for the JPCA Show 2024.

JPCA Show 2024
Official Site

Inquiry

For inquiries about the products to be exhibited, please click below.

click here for inquiry form