JPCA Show 2021 Landing Page
Date:Wed. 27 October - Fri. 29 October, 2021(10:00 - 17:00)
Place:Tokyo Big Sight, South Exhibition Halls
Message
Nippon Electric Glass is a glass manufacturer that has been in business for more than 70 years. We are able to provide integrated services including design, melting, and processing of glass to meet the challenges of each customer. We have a wide range of glass products to meet a wide range of requirements.
At JPCA Show 2021, we are exhibiting products for 5G, sterilization/antibacterial and semiconductor applications. New products such as materials for LTCC with low loss tangent are exhibited. We are looking forward to seeing you at JPCA Show 2021.
Products
Solution For 5G
Materials for LTCC with Low Loss Tangent
We successfully developed three types of materials (high CTE, high mechanical strength and low dielectric constant) for LTCC featuring a low loss tangent. It contributing to reduction of signal attenuation in the communications field such as 5G. It can adapt to market needs and contribute to improving the performance of next-generation communication equipmentす。 
Optical Component with Metallization / AuSn Solder
Optical component with metallization / AuSn solder contributes to the ease of mounting. We propose optimum coating specification for your usage and jointing.
Powder Glass
Our powder glass is widely used to form insulating films, coat electronic components, and hermetic seal devices. Since requirements differ from application to application, we have developed and produced several hundred types of powder glass.
Band Pass Filter for 3D LiDAR
This optical coated glass transmits or reflects light of any wavelength. It is used as wavelength selective transmission filter of automotive LiDAR system.
Glass-ribbon
Glass-ribbon is so thin that it can be bent or rolled up like resin film. The glass surface is unpolished, but it is extremely flat and smooth. Glass-ribbon is characterized by rounded edges on both sides. T his enables enhanced durability in the face of bending and twisting pressure. The improvement of our production technology enables us to offer max. 30mm-wide and 15 μm-thick Glass-ribbon now.
Solution For Sterilization / Antibacterial
Lid with Sealing Material for UV-C LEDs
For UV-C LEDs used for sterilization and virus inactivation, we have developed two new cap lids with the world's highest light extraction efficiency. Both of them use UV-C highl-transmitting glass <BU-41>, which has a coefficient of thermal expansion close to that of aluminum nitride (AlN), and achieves highly reliable sealing.
Phosphor-Glass Composite for UV Wavelength Lumiphous®
Phosphor-glass composite Lumiphous® for U V wavelength was developed as wavelength conversion glass for UV lamp and UV-LED and it customizes various wavelength conversions
according to the wavelength of the light source. It also has excellent heat, water and light resistance, and realizes high reliability and long-life conversion because of an inorganic composite material.
Antibacterial Glass Powder
New types of antibacterial glass powders that are mainly composed of zinc. Compared to conventional antibacterial glass, which is mainly composed of silver, they are advantageous in that they make it difficult for resin to become discolored, and they also provide better cost performance.
Lid with Sealing Material for Packages of Optical Devices
To realize a highly reliable LED, LD, and sensor package, we have developed a lid with a sealing material that reduces damage due to the difference in heat shrinkage after sealing to a cavity.
UV-C High-transmitting Glass Tube <BU-41>
We supply UV-C high-transmitting borosilicate glass tubes.
Solution For Semiconductor
Powder Glass
Our powder glass is widely used to form insulating films, coat electronic components, and hermetic seal devices. Since requirements differ from application to application, we have developed and produced several hundred types of powder glass.
Negative CTE Filler
As Negative CTE(coefficient of thermal expansion) Filler has a property that its volume will become smaller with a rise of temperature, it is effective to reduce the thermal expansion of the resin composite. Its shape of sphere contributes to the excellent filling status into resin.
Glass Frit for Laser-Sealing of Ceramics Packages
Glass frit for laser-sealing can create hermetic seals between glass lids and ceramic packages. This glass frit has a lower CTE(coefficient of thermal expansion) than conventional products and excellent wettability with ceramics. Therefore, this glass frit is suitable for hermetic sealing applications requiring high reliability.
Glass Tubes for Encapsulation
We provide glass tubes with excellent sealing performance. We produce a large number of environmentally friendly lead-free products as well.
Glass for Supporting Semiconductor Wafers
Various CTE(coefficient of thermal expansion) glasses are available as substrates for supporting semiconductor wafers.
Glass for Supporting Semiconductor Wafers
LTCC(Low Temperature Cofired Ceramics) substrates possess excellent electrical characteristics. In addition, they enable multi-layering, dense-mounting and lower profile of electronic devices. Thus, they are used for communication module substrates, probe card substrates used in semiconductor inspection and high thermal conductivity LED packages, etc. Application of LTCC is spreading to the fields of communication devices, semiconductor processes, automobile devices, and beyond.
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Booth Location
Booth Location
Tokyo Big Sight
South Exhibition Hall 1,2 No. 1F-04
Access
Tokyo Big Sight South Exhibition Hall

3 Chome-11-1 Ariake, Koto City, Tokyo 135-0063, Japan

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